The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jul. 11, 2014
Renesas Electronics Corporation, Kawasaki-shi, JP;
Yosuke Imazeki, Kawasaki, JP;
Soshi Kuroda, Kawasaki, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
To enhance the reliability of a semiconductor device. The semiconductor device includes a wiring substrate having a plurality of bonding fingers (terminal) formed on a chip-mounting surface, a semiconductor chip mounted on the wiring substrate, a plurality of wires having a ball part and a stitch part respectively. The bonding fingers have a first bonding finger to which the stitch part of the first wire is coupled respectively, and the second bonding finger to which a ball part of the second wire is coupled. In addition, in plan view, the second bonding finger is arranged at a position different from the arrangement of a plurality of first bonding fingers, and the width of the second bonding finger is larger than the width of the first bonding finger.