The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Sep. 10, 2012
Applicant:
Byung Wook Bae, Icheon-si, KR;
Inventor:
Byung Wook Bae, Icheon-si, KR;
Assignee:
SK HYNIX, Icheon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 22/34 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device is provided to check through silicon via (TSV) connectivity at a wafer level. The semiconductor device includes a first metal layer formed over a through silicon via (TSV), a second metal layer and a third metal layer formed at both sides of the first metal layer to be electrically coupled to the TSV, and a fourth metal layer formed over the first metal layer to be electrically coupled to the first metal layer.