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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9281230 B1

PDFFull Text
Date of Patent:
Mar. 08, 2016

Filed:

Sep. 28, 2009

Apparatus for manufacturing a hierarchical structure

Applicants:

Jae-hyun Kim, Daejeon, KR;

Hak-joo Lee, Daejeon, KR;

Seung-min Hyun, Daejeon, KR;

Seung-woo Han, Daejeon, KR;

Byung-ik Choi, Daejeon, KR;

Inventors:

Jae-Hyun Kim, Daejeon, KR;

Hak-Joo Lee, Daejeon, KR;

Seung-Min Hyun, Daejeon, KR;

Seung-Woo Han, Daejeon, KR;

Byung-Ik Choi, Daejeon, KR;

Assignee:

KOREA INSTITUTE OF MACHINERY & MATERIALS, Daejeon, KR;

Attorney:

Pearl Cohen Zedek Latzer Baratz LLP

Primary Examiner:

Sonya Mazumdar

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B29C 43/46 (2006.01); B29C 43/48 (2006.01); B29C 47/06 (2006.01); B32B 27/00 (2006.01); H01L 23/02 (2006.01); B29L 9/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B29C 47/067 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); B29C 2043/463 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/95145 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/1461 (2013.01); Y10T 156/1195 (2015.01); Y10T 156/1705 (2015.01); Y10T 156/1744 (2015.01);
Abstract

The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.

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