The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jun. 04, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;
Inventors:
Byung Kwon Yoon, Gyunggi-do, KR;
Min Gon Lee, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H01G 4/012 (2013.01); Y10T 29/417 (2015.01);
Abstract
There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.