The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Oct. 17, 2014
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Kyu Bong Kong, Suwon-si, KR;
Kwang Jin Na, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/34 (2006.01); G11C 11/4096 (2006.01); G11C 7/10 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01);
U.S. Cl.
CPC ...
G11C 11/4096 (2013.01); G11C 5/025 (2013.01); G11C 5/066 (2013.01); G11C 7/1006 (2013.01);
Abstract
A semiconductor package may include a first die and a second die disposed adjacent to the first die. The semiconductor package may include a plurality of pads configured for receiving and outputting data mask addresses. The semiconductor package may include mapping blocks configured to map data mask signals among the first die, the second die, and the plurality of pads in response to a received address.