The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Nov. 20, 2009
Applicants:

Hajime Nishi, Hitachi, JP;

Yuju Endo, Hitachi, JP;

Ken Takahashi, Mito, JP;

Hiromitsu Kuroda, Hitachi, JP;

Hiroyuki Akutsu, Hitachi, JP;

Katsunori Sawahata, Hitachi, JP;

Hiroshi Bando, Hitachi, JP;

Iku Higashidani, Hitachi, JP;

Hiroshi Okikawa, Hitachi, JP;

Inventors:

Hajime Nishi, Hitachi, JP;

Yuju Endo, Hitachi, JP;

Ken Takahashi, Mito, JP;

Hiromitsu Kuroda, Hitachi, JP;

Hiroyuki Akutsu, Hitachi, JP;

Katsunori Sawahata, Hitachi, JP;

Hiroshi Bando, Hitachi, JP;

Iku Higashidani, Hitachi, JP;

Hiroshi Okikawa, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 5/00 (2006.01); C23C 2/08 (2006.01); C23C 2/02 (2006.01); C23C 6/00 (2006.01); C23C 26/02 (2006.01); H01L 31/05 (2014.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C23C 2/08 (2013.01); C23C 2/02 (2013.01); C23C 6/00 (2013.01); C23C 26/02 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); H01L 31/0508 (2013.01); H01L 31/0512 (2013.01); Y02E 10/50 (2013.01);
Abstract

A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnOlayer on the surface of the molten solder plated layer, is not more than 7 nm.


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