The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jan. 10, 2014
Applicant:
Floor Iptech Ab, Viken, SE;
Inventors:
Darko Pervan, Viken, SE;
Tony Pervan, Stockholm, SE;
Assignee:
FLOOR IPTECH AB, Viken, SE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 1/24 (2006.01); C09D 11/103 (2014.01); B41F 17/00 (2006.01); B41J 2/32 (2006.01); B41J 2/325 (2006.01); B05D 3/00 (2006.01); B05D 3/06 (2006.01); B41M 5/50 (2006.01); B41J 11/00 (2006.01); B41J 3/28 (2006.01); B41J 3/407 (2006.01); B44C 1/24 (2006.01); B44C 5/04 (2006.01); C08K 3/22 (2006.01); C09D 197/02 (2006.01);
U.S. Cl.
CPC ...
C09D 11/103 (2013.01); B05D 3/002 (2013.01); B05D 3/065 (2013.01); B41F 17/00 (2013.01); B41J 2/32 (2013.01); B41J 2/325 (2013.01); B41J 3/28 (2013.01); B41J 3/407 (2013.01); B41J 11/0015 (2013.01); B41M 5/50 (2013.01); B44C 1/24 (2013.01); B44C 5/04 (2013.01); C08K 3/22 (2013.01); C09D 197/02 (2013.01); C08K 2003/2227 (2013.01); Y10T 428/24066 (2015.01); Y10T 428/24901 (2015.01);
Abstract
A method of forming a digital embossing () on a surface () by bonding hard press particles () to a carrier (). A liquid binder pattern (P) is applied on the carrier by a digital drop application head. Hard press particles () are applied on the carrier () and the binder pattern such that some hard press particles are bonded to the carrier () by the liquid pattern and non-bonded press particles () are removed. The carrier () with the bonded hard press particles () is pressed to the surface () and an embossing is formed when the carrier () with the hard press particles () is removed.