The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Jun. 18, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ho Dong Kim, Daejeon, KR;

Sang Wook Na, Daejeon, KR;

A Young Hur, Daejeon, KR;

Soo Min Lee, Daejeon, KR;

Sung Tae Ahn, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 67/02 (2006.01); C08G 63/66 (2006.01); C08L 67/00 (2006.01); C08L 51/00 (2006.01);
U.S. Cl.
CPC ...
C08L 67/025 (2013.01); C08G 63/66 (2013.01); C08L 51/003 (2013.01); C08L 67/00 (2013.01); C08L 2201/08 (2013.01); C08L 2205/03 (2013.01); C08L 2207/04 (2013.01);
Abstract

Disclosed are a thermoplastic polyester elastomer resin composition and a molded article comprising the same. More specifically, disclosed is a thermoplastic polyester elastomer resin composition which comprises a glycidyl-modified ethylene-octene copolymer resin, as a chain extension/hydrolysis resistance agent for blown and extrusion molding to improve melt viscosity, and increases a molecular weight through reaction extrusion and thus exhibits superior heat resistance, weather resistance, heat aging resistance, hydrolysis resistance, fatigue resistance, melt viscosity and parison stability, and in particular, exhibits superior blow molding, causes no gelation, and reduces production of odor-causing substances such as volatile organic compounds (TVOC) during blow molding, thereby making a balance between physical properties, molding property and operation environments.


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