The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Dec. 06, 2012
Applicant:
Illinois Tool Works Inc., Glenview, IL (US);
Inventors:
Michael J. Rancich, Houston, TX (US);
Ronald C. Hoffart, Jr., Porter, TX (US);
Assignee:
Illinois Tool Works Inc., Glenview, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 73/00 (2006.01); B32B 37/00 (2006.01); B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 27/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/12 (2013.01); B32B 27/10 (2013.01); B32B 2307/31 (2013.01); B32B 2307/516 (2013.01); B32B 2307/5825 (2013.01); B32B 2553/00 (2013.01); B65D 73/0078 (2013.01); B65D 73/0085 (2013.01); B65D 73/0092 (2013.01);
Abstract
A method for making a film/board laminate for use in pilfer resistant packaging includes providing a non-treated paperboard substrate, adhering a single ply of an oriented film to the substrate, the oriented film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees such that a film to substrate adhesion is about 0.5 pli to 1.4 pli, and applying a heat seal layer to the film.