The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jul. 20, 2012
Hee-yong Shim, Daejeon, KR;
Jung-jin Shim, Daejeon, KR;
Jeong-an Kang, Daejeon, KR;
Hyun-sung Min, Daejeon, KR;
Hee-Yong Shim, Daejeon, KR;
Jung-Jin Shim, Daejeon, KR;
Jeong-An Kang, Daejeon, KR;
Hyun-Sung Min, Daejeon, KR;
LG CHEM, LTD., Seoul, KR;
Abstract
The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.