The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Apr. 27, 2010
Applicants:

Andrew David Wescott, Bristol, GB;

Benjamin Richard Moreland, Church Stretton, GB;

Jagjit Sidhu, Bristol, GB;

Inventors:

Andrew David Wescott, Bristol, GB;

Benjamin Richard Moreland, Church Stretton, GB;

Jagjit Sidhu, Bristol, GB;

Assignee:

BAE SYSTEMS PLC, London, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B29C 67/00 (2006.01); B22F 3/105 (2006.01); B23K 35/02 (2006.01); B23K 26/32 (2014.01); C23C 24/00 (2006.01); C23C 16/48 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0077 (2013.01); B22F 3/1055 (2013.01); B23K 26/32 (2013.01); B23K 26/342 (2015.10); B23K 35/0244 (2013.01); B22F 2003/1056 (2013.01); B23K 2203/50 (2015.10); C23C 16/483 (2013.01); C23C 24/00 (2013.01); Y02P 10/295 (2015.11);
Abstract

A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated while the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.


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