The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Jun. 29, 2011
Yujiro Kaneko, Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Yujiro Kaneko, Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power module includes a power unit equipped with plural power semiconductor devices, heat sinks, and a housing case. The power unit includes the power semiconductor devices, lead frames, and a sealing resin. The lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin. The housing case includes a housing base and a housing cover. The housing base, heat sink, power unit, heat sink, and housing cover are layered in that order. Assuming that Sdenotes the outline size of the housing base, Sdenotes the outline size of the housing cover, Sdenotes the size of the lead frame bared part of the power unit, the relationship of S>S>Sis established. The housing cover is pressed and fixed to a receiving part of the housing base.