The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Aug. 29, 2013
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventor:
Nobuto Fujiwara, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02B 1/00 (2006.01); H02B 1/56 (2006.01); G06F 1/20 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H05K 7/20 (2013.01); H05K 7/2029 (2013.01); H05K 7/20445 (2013.01); F28D 15/00 (2013.01); F28F 7/00 (2013.01); G06F 2200/201 (2013.01);
Abstract
According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.