The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Mar. 18, 2013
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Andreas Gruendl, Laaber, DE;

Stefan Gruber, Bad Abbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/505 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract

In at least one embodiment of the optoelectronic semiconductor component (), the optoelectronic semiconductor component has a support (). At least one optoelectronic semiconductor chip () with a radiation outlet face () is applied onto a support upper face (). A sacrificial layer () is located over the radiation outlet face () in the direction away from the support (). A housing body () which has a housing upper face () is molded around the semiconductor chip () and/or around the sacrificial layer () in a lateral direction parallel to the radiation outlet face (). A sacrificial layer () upper face () which faces away from the radiation outlet face () is free of a housing body () material.


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