The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Nov. 07, 2013
Applicant:

Nichia Corporation, Ana-shi, Tokushima, JP;

Inventors:

Masashi Ishida, Anan, JP;

Daisuke Sato, Anan, JP;

Tadayuki Kitajima, Itano-gun, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 23/28 (2013.01); H01L 23/31 (2013.01); H01L 23/3135 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 33/505 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.


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