The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Nov. 26, 2012
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Tzu Chieh Hsu, Hsinchu, TW;

Ching-Pei Lin, Hsinchu, TW;

Yen Ming Hsu, Hsinchu, TW;

Shou-Chin Wei, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0062 (2013.01); H01L 33/22 (2013.01); H01L 33/44 (2013.01); H01L 33/0079 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method of fabricating an optoelectronic device, comprising: providing a first substrate; forming an epitaxial stack on the first substrate wherein the epitaxial stack comprising a first conductive-type semiconductor layer, an active layer and a second conductive-type semiconductor layer; etching an upper surface of the second conductive-type semiconductor layer and forming a first texture profile on the upper surface of the second conductive-type semiconductor layer; forming a passivation layer on the upper surface of the second conductive-type semiconductor layer; and etching an upper surface of the passivation layer forming a second texture profile on the upper surface of the passivation layer wherein the first texture profile is different from the second texture profile.


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