The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Dec. 21, 2012
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Katsumi Hashimoto, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
The present invention provides a dynamic quantity device which reduces stress received by a sensor due to resin packaging and reduces variation in sensor characteristics due to stress. The dynamic quantity sensor includes a semiconductor substrate including a fixing part and a flexible part and a movable part positioned on an interior side of the fixing part, and a cap component configured to cover the flexible part and the movable part, wherein the fixing part includes an interior frame configured to enclose the flexible part and the movable part and an exterior part positioned on a periphery of the interior frame, a slit configured to divide the interior frame and the exterior frame, and a linking part configured to link the interior frame and the exterior frame.