The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Aug. 13, 2014
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventors:
Yan Chen, South Windsor, CT (US);
Sergei F. Burlatsky, West Hartford, CT (US);
Mikhail B. Gorbounov, South Windsor, CT (US);
Assignee:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 2224/4905 (2013.01);
Abstract
A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire.