The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Oct. 16, 2014
Applicant:
SK Hynix Inc., Icheon, KR;
Inventors:
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 2224/1703 (2013.01);
Abstract
A flip chip package includes a chip having a surface, main bumps disposed on a first region of the surface of the chip, dummy bumps disposed on a second region of the surface of the chip, a substrate having a surface, dams disposed on the surface of the substrate, connection pads disposed on the surface of the substrate and electrically connected to respective ones of the main bumps, and adhesion patterns attaching the dummy bumps to respective ones of the dams.
Jeong, Jung. (2016). Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same (U.S. Patent No. 9275968). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9275968
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile