The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Jun. 21, 2012
Applicant:
Josef C. Drobnik, Mesa, AZ (US);
Inventor:
Josef C. Drobnik, Mesa, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 25/07 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/5385 (2013.01); H01L 23/642 (2013.01); H01L 24/17 (2013.01); H01L 24/40 (2013.01); H01L 25/072 (2013.01); H01L 23/50 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An electronic apparatus includes a base substrate, the base substrate including an interconnect. The electronic apparatus further includes a first die including a first semiconductor device, the first semiconductor device being coupled to the interconnect, and further includes a second die including a second semiconductor device, the second semiconductor device being coupled to the interconnect. The first and second die are attached to the base substrate in opposite orientations.