The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

May. 29, 2012
Applicant:

Yuya Okada, Kawasaki, JP;

Inventor:

Yuya Okada, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/10 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/52 (2013.01); H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 23/49811 (2013.01); H01L 23/564 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/09701 (2013.01);
Abstract

Provided is a semiconductor device in which a semiconductor element mounted on a wiring substrate is placed in a hollow portion, the hollow portion being formed by the wiring substrate, a protective member, and a wall member, with the wiring substrate, the protective member, and the wall member being a bottom surface, a top surface, and side surfaces thereof, respectively. The wall member has a vent hole provided therein, which communicates the hollow portion to/from the outside, and the vent hole includes a pillar member formed of a material having a linear expansion coefficient which is smaller than that of the wall member. Therefore, airtightness of the hollow portion is maintained to prevent entry of foreign matters at ordinary temperature, and vapor pressure in the hollow portion is relieved when heated.


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