The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Feb. 26, 2014
Kabushiki Kaisha Toshiba, Tokyo, JP;
Isao Ozawa, Kanagawa, JP;
Isao Maeda, Kanagawa, JP;
Yasuo Kudo, Tokyo, JP;
Koichi Nagai, Tokyo, JP;
Katsuya Murakami, Tokyo, JP;
Akira Tanimoto, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.