The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Apr. 22, 2014
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Young Jun Yu, Daejeon, KR;

Jin Soo Kim, Seoul, KR;

Hong Kyw Choi, Daejeon, KR;

Jin Sik Choi, Daejeon, KR;

Jin Tae Kim, Daejeon, KR;

Kwang Hyo Chung, Daejeon, KR;

Doo Hyeb Youn, Daejeon, KR;

Choon Gi Choi, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 29/778 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02628 (2013.01); H01L 21/0259 (2013.01); H01L 21/02381 (2013.01); H01L 21/02422 (2013.01); H01L 21/02568 (2013.01); H01L 29/24 (2013.01); H01L 29/778 (2013.01);
Abstract

A method of manufacturing a junction electronic device having a 2-Dimensional (2D) material as a channel, includes forming a pattern portion by surface-treating a substrate so that the patterned portion has a higher surface potential than other portions of the substrate; bonding a 2D material to rthe patterned portion having the higher surface potential by spraying a liquid including 2D material flakes onto the substrate; forming a pair of first electrodes in contact with both ends of the 2D material disposed on the substrate; forming a dielectric layer on the first electrodes and the 2D material; and forming a second electrode on the dielectric layer. The 2D materials are disposed at desired positions by chemical exfoliation.


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