The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Dec. 10, 2012
Applicant:

Cooper Technologies Company, Houston, TX (US);

Inventors:

Yipeng Yan, Shanghai, CN;

Robert James Bogert, Lake Worth, FL (US);

Guo Ouyang, Guangdong, CN;

Zhigang Cheng, Jinagxi, CN;

Assignee:

COOPER TECHNOLOGIES COMPANY, Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/30 (2006.01); H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 41/00 (2006.01); H01F 41/02 (2006.01); H01F 3/14 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 27/303 (2013.01); H01F 17/04 (2013.01); H01F 27/2847 (2013.01); H01F 27/306 (2013.01); H01F 41/00 (2013.01); H01F 41/0246 (2013.01); H01F 3/14 (2013.01); H01F 17/043 (2013.01); H01F 27/255 (2013.01); H01F 27/292 (2013.01); H01F 2017/046 (2013.01); Y10T 29/49073 (2015.01);
Abstract

Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.


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