The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Jul. 25, 2014
Applicant:

Hgst Netherlands B.v., Amsterdam, NL;

Inventors:

Tuan M. Dinh, San Jose, CA (US);

David P. Druist, Santa Clara, CA (US);

David J. Seagle, Morgan Hill, CA (US);

Michael M. H. Yang, Campbell, CA (US);

Assignee:

HGST Netherlands B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 (2006.01); G11B 5/48 (2006.01); H01L 49/02 (2006.01); H01L 21/311 (2006.01); H01L 21/285 (2006.01); H01L 21/02 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4846 (2013.01); G11B 5/6082 (2013.01); H01L 21/02271 (2013.01); H01L 21/28568 (2013.01); H01L 21/31105 (2013.01); H01L 27/0248 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01);
Abstract

In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor. In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor configured to AC couple an electronics ground of the slider to the substrate and DC decouple the electronics ground of the slider from the substrate, the coupling capacitor including: a first conductive layer, a gap layer positioned above the first conductive layer, a dielectric layer positioned above the gap layer and the first conductive layer, and a second conductive layer positioned above the dielectric layer. In another embodiment, a method for forming a capacitor includes forming a substrate, forming a first conductive layer above the substrate, forming a gap layer above the first conductive layer, forming a dielectric layer above the gap layer and the first conductive layer, and forming a second conductive layer above the dielectric layer.


Find Patent Forward Citations

Loading…