The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Aug. 05, 2013
Applicant:

Nec Tokin Corporation, Sendai-shi, Miyagi, JP;

Inventors:

Yuji Nitobe, Sendai, JP;

Masahiro Saito, Sendai, JP;

Shigemi Fujiwara, Sendai, JP;

Akitoshi Shimo, Sendai, JP;

Assignee:

NEC TOKIN CORPORATION, Sendai-Shi, Miyagi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/34 (2006.01); G01J 5/04 (2006.01); G01J 5/02 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G01J 5/34 (2013.01); G01J 5/0285 (2013.01); G01J 5/045 (2013.01); H05K 1/181 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0219 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/2036 (2013.01); Y02P 70/611 (2015.11);
Abstract

An infrared sensor includes a circuit board, at least two support portions, a FET element and a pyroelectric element. The circuit board has an upper principal surface formed with plural electrodes. Each of the support portions has an upper surface, a lower surface, an upper conductive pattern formed on the upper surface and a lower conductive pattern formed on the lower surface. The upper conductive pattern is electrically connected with the lower conductive pattern. The lower conductive pattern is connected to an electrode of the upper principal surface of the circuit board. The FET element is located between the at least two support portions and arranged on the upper principal surface of the circuit board. The pyroelectric element is electrically connected with the upper conductive patterns of the support portions, and is supported by the support portions so as to be located above the FET element.


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