The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9273527 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 01, 2016

Filed:

Feb. 07, 2013
Applicant:

Robert P. Badrak, Sugar Land, TX (US);

Inventor:

Robert P. Badrak, Sugar Land, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 17/10 (2006.01); E21B 33/129 (2006.01); C23C 14/34 (2006.01); C23C 14/48 (2006.01); E21B 23/01 (2006.01); B23K 9/04 (2006.01); F21V 33/00 (2006.01); C23C 14/58 (2006.01);
U.S. Cl.
CPC ...
E21B 23/01 (2013.01); B23K 9/042 (2013.01); C23C 14/34 (2013.01); C23C 14/48 (2013.01); C23C 14/584 (2013.01); E21B 17/1085 (2013.01); E21B 33/129 (2013.01); F21V 33/00 (2013.01);
Abstract

A slip component for a downhole tool has a bearing surface hard surface treated. The slip component, which can be a slip or other component of a slip mechanism used on a packer, bridge plug, or other downhole tool, is composed of a metallic base material such as magnesium, aluminum, an aluminum alloy, or a magnesium alloy. To hard surface treat the slip component, at least the bearing surface is positioned relative to an electro sparking apparatus. Using the electrosparking apparatus, an external layer is bonded at least on the bearing. In a further embodiment, an intermediate layer can be first bonded onto at least the bearing surface by ion sputtering an intermediate material onto the metallic base material of the slip component. Then, an external layer can be bonded at least on the intermediate layer by electrospark deposition.


Find Patent Forward Citations

Loading…