The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Mar. 14, 2013
Applicant:

Veeco Instruments Inc., Plainview, NY (US);

Inventors:

Sandeep Krishnan, Plainview, NY (US);

Alexander I. Gurary, Bridgewater, NJ (US);

Keng Moy, Basking Ridge, NJ (US);

Assignee:

Veeco Instruments Inc., Plainview, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/12 (2006.01); C30B 25/10 (2006.01); C23C 16/458 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
C30B 25/12 (2013.01); C23C 16/458 (2013.01); C23C 16/4586 (2013.01); C30B 25/10 (2013.01); C30B 29/40 (2013.01); Y10T 137/0318 (2015.04);
Abstract

Wafer carrier arranged to hold a plurality wafers and to inject a fill gas into gaps between the wafers and the wafer carrier for enhanced heat transfer and to promote uniform temperature of the wafers. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers. In various embodiments, the wafer carrier utilizes at least one plenum structure contained within the wafer carrier to source a plurality of weep holes for passing a fill gas into the wafer retention pockets of the wafer carrier. The plenum(s) promote the uniformity of the flow, thus providing efficient heat transfer and enhanced uniformity of wafer temperatures.


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