The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Mar. 14, 2013
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Tianjian Huang, Hillsborough, NJ (US);
Kristina Thompson, Clinton, NJ (US);
James Layser, Easton, PA (US);
John Harrington, Ledgewood, NJ (US);
John Meccia, Ringoes, NJ (US);
Robert Mammarella, Greer, SC (US);
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D06N 7/00 (2006.01); D06N 7/04 (2006.01); C09J 5/08 (2006.01); B32B 29/00 (2006.01); B32B 7/12 (2006.01); C09J 131/04 (2006.01);
U.S. Cl.
CPC ...
C09J 5/08 (2013.01); B32B 7/12 (2013.01); B32B 29/005 (2013.01); C09J 131/04 (2013.01); B32B 2255/12 (2013.01); B32B 2255/26 (2013.01); B32B 2307/306 (2013.01); B32B 2553/00 (2013.01); C09J 2205/11 (2013.01); C09J 2429/00 (2013.01); C09J 2431/00 (2013.01); Y10T 428/1303 (2015.01); Y10T 428/254 (2015.01);
Abstract
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.