The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Feb. 07, 2013
Applicant:
National Chung Hsing University, Taichung, TW;
Inventors:
Chia-Jung Yang, Kaohsiung, TW;
Fu-Hsing Lu, Taichung, TW;
Assignee:
NATIONAL CHUNG HSING UNIVERSITY, Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B82Y 40/00 (2011.01); B82Y 30/00 (2011.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01); C25D 17/10 (2006.01);
U.S. Cl.
CPC ...
B82Y 30/00 (2013.01); C25D 3/38 (2013.01); C25D 5/18 (2013.01); C25D 17/10 (2013.01); B82Y 40/00 (2013.01);
Abstract
A method for electrodepositing copper nanoparticles includes the steps of a) providing a reaction system having an electrolyte solution, a conductive nitride film used as a working electrode and immersed in the electrolyte solution, a copper metal or a copper alloy used as an auxiliary electrode and immersed in the electrolyte solution, and a reference electrode immersed in the electrolyte solution; and b) applying a pulse voltage to the reaction system to form copper nanoparticles on a surface of the conductive nitride film.