The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Mar. 24, 2011
Applicants:

Shinichiro Okada, Minami-Ashigara, JP;

Shotaro Ogawa, Minami-Ashigara, JP;

Inventors:

Shinichiro Okada, Minami-Ashigara, JP;

Shotaro Ogawa, Minami-Ashigara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/42 (2006.01); H01L 21/683 (2006.01); B29C 59/00 (2006.01); B29C 33/44 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/002 (2013.01); B29C 33/424 (2013.01); B29C 33/44 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29C 33/42 (2013.01); H01L 21/6838 (2013.01); Y10T 156/1195 (2015.01); Y10T 156/1928 (2015.01); Y10T 156/1994 (2015.01);
Abstract

A minute convexo-concave pattern forming method includes: transferring a minute convexo-concave pattern of a mold to a resist layer of a transfer substrate where a resist layer is formed on a substrate and curing the transferred minute convexo-concave pattern; and after curing the transferred minute convexo-concave pattern, peeling the transfer substrate and the mold, the peeling step including: pressurizing a substrate back surface side of the transfer substrate with a peripheral part of the transfer substrate being fixed to bend the transfer substrate in a curved shape and starting peeling of the transfer substrate and the mold with a bending of the transfer substrate; and peeling a part of the minute convexo-concave pattern of the transfer substrate not peeled in the first peeling step by gradually decreasing a pressure for a pressurization so as to undo the bending of the transfer substrate.


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