The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9272390 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 01, 2016

Filed:

Jul. 25, 2014
Applicant:

Tera Xtal Technology Corporation, Hsinchu, TW;

Inventors:

Wen-Yen Shen, Hsinchu, TW;

Jun-Wen Chung, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 53/12 (2006.01); B24B 53/02 (2012.01); B24D 7/02 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 53/12 (2013.01); B24D 7/02 (2013.01);
Abstract

A pad conditioning tool includes a sapphire substrate with a specific orientation plane, wherein the specific orientation plane is selected from a group consisting of a-plane, c-plane, r-plane, m-plane, n-plane and v-plane, the sapphire substrate further defining a mounting surface; and a plurality of sapphire dressing particles and a plurality of scrapers formed on the mounting surface of the substrate in a predetermined geometric arrangement, wherein the dressing particles are scattered between an adjacent pair of the scrapers. In case a wafer polishing pad is conditioned by the dressing particles of the pad conditioning tool, the scrapers are capable of removing abrasive waste and particles from the wafer polishing pad during a dressing operation, thereby forming new trenches and cilia structure on a polishing surface of the wafer polishing pad.


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