The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

May. 30, 2013
Applicants:

Agc Automotive Americas R&d, Inc., Ypsilanti, MI (US);

Agc Flat Glass North America, Inc., Alpharetta, GA (US);

Inventor:

Timothy P. Hoepfner, Grand Ledge, MI (US);

Assignees:

AGC AUTOMOTIVE AMERICAS R&D, INC., Ypsilanti, MI (US);

AGC FLAT GLASS NORTH AMERICA, INC., Alpharetta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); B23K 35/24 (2006.01); B23K 35/26 (2006.01); H05B 3/84 (2006.01);
U.S. Cl.
CPC ...
B23K 35/24 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); H05B 3/84 (2013.01); H05K 1/181 (2013.01); H05B 2203/016 (2013.01); H05K 2201/1031 (2013.01); H05K 2203/05 (2013.01);
Abstract

A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed.


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