The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Oct. 17, 2012
Applicant:

Goertek Inc., Weifang, CN;

Inventors:

Rongguo Yao, Weifang, CN;

Zhongyuan Liu, Weifang, CN;

Xianbin Wang, Weifang, CN;

Maoqiang Dang, Weifang, CN;

Shaoyang Yao, Weifang, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H05K 13/04 (2006.01); B23P 17/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/046 (2013.01); B23P 17/04 (2013.01); H04R 19/04 (2013.01); Y10T 29/49 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/4957 (2015.01); Y10T 29/49993 (2015.01);
Abstract

A method of manufacturing a protection frame used in a miniature microphone is provided. In one embodiment, the method comprises the steps of: (1) preparing a substrate made of an insulating material with a prescribed thickness and a prescribed area; (2) forming a plurality of holes at prescribed intervals on the substrate; (3) forming a first metal shielding layer on the inner surface of each of the plurality of holes formed on the substrate; (4) filling an insulating material in the plurality of holes; (5) forming a plurality of extended portions on the surfaces of both sides of the substrate, each extended portion covering a part of the end face of the insulating material and the whole end face of the first metal shielding layer of a hole; (6) forming a cavity in each insulating material-filled hole, the caliber of each cavity being slightly smaller than the inner caliber of the corresponding extended portion formed in the above mentioned step (5); and (7) cutting the plurality of holes from the substrate to produce a collection of protection frames.


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