The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jul. 16, 2013
Applicant:

Kabushiki Kaisha Nihon Micronics, Tokyo, JP;

Inventors:

Noboru Otabe, Aomori, JP;

Toshinori Omori, Aomori, JP;

Takayasu Sugai, Aomori, JP;

Assignee:

Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/167 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09781 (2013.01);
Abstract

A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.


Find Patent Forward Citations

Loading…