The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jul. 15, 2014
Applicants:
Sunaina Srivastava, Gurgaon, IN;
Raza Imam, Ghaziabad, IN;
Gagan Kansal, Gurgaon, IN;
Sumit Varshney, Noida, IN;
Inventors:
Sunaina Srivastava, Gurgaon, IN;
Raza Imam, Ghaziabad, IN;
Gagan Kansal, Gurgaon, IN;
Sumit Varshney, Noida, IN;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 1/02 (2006.01); H01L 23/64 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 23/552 (2013.01); H01L 23/64 (2013.01); H01L 24/48 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/4899 (2013.01);
Abstract
A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The shielding wire (or wires) provide active shielding to the guarded wire by simultaneously transmitting the same signal as the guarded wire between the multi-wire lead the multi-site bond pad.