The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jun. 21, 2012
Applicants:

Markus Lermer, Donaustauf, DE;

Martin Haushalter, Regensburg, DE;

Inventors:

Markus Lermer, Donaustauf, DE;

Martin Haushalter, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 31/173 (2006.01); H01L 31/0203 (2014.01); H01L 31/167 (2006.01); G01S 7/481 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 31/173 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/167 (2013.01); G01S 7/4813 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.


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