The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Feb. 13, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Stefan Willkofer, Munich, DE;
Uwe Wahl, Munich, DE;
Bernhard Knott, Neumarkt, DE;
Markus Hammer, Pielenhofen, DE;
Andreas Strasser, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 23/48 (2013.01); H01L 23/49575 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 25/0657 (2013.01); H01L 28/10 (2013.01); H01F 2017/0086 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01); Y10T 29/4902 (2015.01);
Abstract
A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.