The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
May. 13, 2013
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Nan-Jang Chen, Hsinchu, TW;
Yau-Wai Wong, Hsinchu, TW;
Assignee:
MEDIATEK INC., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49558 (2013.01); H05K 1/0216 (2013.01); H05K 1/0245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/30111 (2013.01);
Abstract
A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.