The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jan. 27, 2014
Applicant:
Samsung Display Co., Ltd., Yongin, Gyeonggi-do, KR;
Inventor:
Hee Kwon Lee, Hwaseong-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G02F 1/1345 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G02F 1/13452 (2013.01); H01L 23/4985 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A chip-on-film package includes a base film including a bending area, an integrated circuit chip at an upper surface of the base film, a first line at the upper surface of the base film and overlapping the bending area, a second line at a lower surface of the base film and overlapping the bending area, a via pattern penetrating the base film to electrically couple the first line and the second line, and a common line coupled to the first line and to the integrated circuit chip, wherein at least a portion of the first line does not overlap at least a portion of the second line in a plan view.