The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Aug. 01, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Steven J. Holmes, Albany, NY (US);

David V. Horak, Essex Junction, VT (US);

Charles W. Koburger, III, Delmar, NY (US);

Shom Ponoth, Gaithersburg, MD (US);

Chih-Chao Yang, Glenmont, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/44 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/76807 (2013.01); H01L 21/76808 (2013.01); H01L 21/76811 (2013.01); H01L 21/76819 (2013.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/76883 (2013.01); H01L 23/5226 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A stack of a first metal line and a first dielectric cap material portion is formed within a line trench of first dielectric material layer. A second dielectric material layer is formed thereafter. A line trench extending between the top surface and the bottom surface of the second dielectric material layer is patterned. A photoresist layer is applied over the second dielectric material layer and patterned with a via pattern. An underlying portion of the first dielectric cap material is removed by an etch selective to the dielectric materials of the first and second dielectric material layer to form a via cavity that is laterally confined along the widthwise direction of the line trench and along the widthwise direction of the first metal line. A dual damascene line and via structure is formed, which includes a via structure that is laterally confined along two independent horizontal directions.


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