The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Dec. 11, 2012
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jung Tae Ok, Suwon-si, KR;
Hak Hwan Kim, Suwon-si, KR;
Ho Sun Paek, Suwon-si, KR;
Kwon Joong Kim, Osan-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/485 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76892 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A bump manufacturing method may be provided. The bump manufacturing method may include forming a bump on an electrode pad included in a semiconductor device, and controlling a shape of the bump by reflowing the bump formed on the semiconductor device under an oxygen atmosphere.