The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jan. 05, 2012
Applicants:
Anwar Mohammed, San Jose, CA (US);
Julius Chew, Milpatas, CA (US);
Donald Fowlkes, San Jose, CA (US);
Inventors:
Anwar Mohammed, San Jose, CA (US);
Julius Chew, Milpatas, CA (US);
Donald Fowlkes, San Jose, CA (US);
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/142 (2013.01); H01L 23/3735 (2013.01); H01L 24/28 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/3511 (2013.01);
Abstract
According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.