The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jul. 31, 2013
Applicant:
Wayne State University, Detroit, MI (US);
Inventors:
Yong Xu, Troy, MI (US);
Hongen Tu, Warren, MI (US);
Eric G R Kim, Royal Oak, MI (US);
Jessin K. John, Troy, MI (US);
Assignee:
WAYNE STATE UNIVERSITY, Detroit, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/76 (2006.01); H01L 21/3065 (2006.01); H05K 1/02 (2006.01); H01L 29/06 (2006.01); H01L 21/308 (2006.01); H01L 27/12 (2006.01); B81C 1/00 (2006.01); G01L 19/00 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01); H01L 29/78 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); B81C 1/0019 (2013.01); G01L 19/0092 (2013.01); H01L 21/3081 (2013.01); H01L 21/56 (2013.01); H01L 27/1218 (2013.01); H01L 27/1262 (2013.01); H01L 29/0657 (2013.01); H05K 1/0278 (2013.01); H05K 1/0283 (2013.01); G01L 2009/0069 (2013.01); H01L 29/7842 (2013.01); H05K 3/007 (2013.01);
Abstract
A method of making a flexible, foldable, stretchable electronic device. The method includes deposition of a polymer layer, such as parylene C, to impart flexibility to the device. The device overcomes the limitations of related flexible electronics schemes by employing established silicon-on-insulator complementary metal-oxide-semiconductor technology with a flexible enclosure. Devices made in such a way may be used in a wide variety of applications including incorporation into medical devices.