The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jul. 26, 2011
Ji-young Jeong, Uiwang-si, KR;
Min-kook Chung, Uiwang-si, KR;
Jong-hwa Lee, Uiwang-si, KR;
Mi-ra Im, Uiwang-si, KR;
Hyun-yong Cho, Uiwang-si, KR;
Myoung-hwan Cha, Uiwang-si, KR;
Hwan-sung Cheon, Uiwang-si, KR;
Ji-Young Jeong, Uiwang-si, KR;
Min-Kook Chung, Uiwang-si, KR;
Jong-Hwa Lee, Uiwang-si, KR;
Mi-Ra Im, Uiwang-si, KR;
Hyun-Yong Cho, Uiwang-si, KR;
Myoung-Hwan Cha, Uiwang-si, KR;
Hwan-Sung Cheon, Uiwang-si, KR;
Cheil Industries Inc., Gumi-si, KR;
Abstract
Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided.