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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9268221 B1

PDFFull Text
Expired
Date of Patent:
Feb. 23, 2016

Filed:

Jul. 26, 2011

Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer

Applicants:

Ji-young Jeong, Uiwang-si, KR;

Min-kook Chung, Uiwang-si, KR;

Jong-hwa Lee, Uiwang-si, KR;

Mi-ra Im, Uiwang-si, KR;

Hyun-yong Cho, Uiwang-si, KR;

Myoung-hwan Cha, Uiwang-si, KR;

Hwan-sung Cheon, Uiwang-si, KR;

Inventors:

Ji-Young Jeong, Uiwang-si, KR;

Min-Kook Chung, Uiwang-si, KR;

Jong-Hwa Lee, Uiwang-si, KR;

Mi-Ra Im, Uiwang-si, KR;

Hyun-Yong Cho, Uiwang-si, KR;

Myoung-Hwan Cha, Uiwang-si, KR;

Hwan-Sung Cheon, Uiwang-si, KR;

Assignee:

Cheil Industries Inc., Gumi-si, KR;

Attorney:

Additon, Higgins & Pendleton, P.A.

Primary Examiner:

Michael Pepitone

Assistant Examiner:

Jessica Roswell

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/075 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); G03F 7/0751 (2013.01); G03F 7/40 (2013.01);
Abstract

Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided.

Find Patent Forward Citations

Jeong, Ji-Young. (2016). Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer (U.S. Patent No. 9268221). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9268221

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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