The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Oct. 24, 2007
Applicant:
Eliav Itzhak Haskal, Eindhoven, NL;
Inventor:
Eliav Itzhak Haskal, Eindhoven, NL;
Assignee:
Koninklijke Philips N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 9/24 (2006.01); G02F 1/1333 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/167 (2006.01); H01L 29/786 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133305 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); G02F 1/1362 (2013.01); G02F 1/167 (2013.01); H01L 29/78603 (2013.01); H01L 51/0097 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24942 (2015.01);
Abstract
A method of manufacturing a thin-film electronic device includes applying a plastic coating to a rigid carrier substrate for forming a plastic substrate. The plastic material has a coefficient of thermal expansion greater in a first direction perpendicular to the substrate plane than in a second direction parallel to the substrate plane. Thin film electronic elements are formed over the plastic substrate and the rigid carrier substrate is released from the plastic substrate by a heating process which expands the plastic substrate preferentially in a direction perpendicular to the substrate plane.