The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Oct. 16, 2013
Applicant:

Sandia Corporation, Albuquerque, NM (US);

Inventors:

Robert L. Jarecki, Jr., Albuquerque, NM (US);

Peter Thomas Rakich, New Haven, CT (US);

Ryan Camacho, Albuquerque, NM (US);

Heedeuk Shin, Rochester, NY (US);

Jonathan Albert Cox, Albuquerque, NM (US);

Wenjun Qiu, Chicago, IL (US);

Zheng Wang, Austin, TX (US);

Assignee:

Sandia Corporation, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 6/26 (2006.01); G02F 1/125 (2006.01); G02F 1/11 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
G02B 6/26 (2013.01); G02B 6/1225 (2013.01); G02F 1/11 (2013.01); G02F 1/125 (2013.01); G02B 6/122 (2013.01);
Abstract

The various technologies presented herein relate to various hybrid phononic-photonic waveguide structures that can exhibit nonlinear behavior associated with traveling-wave forward stimulated Brillouin scattering (forward-SBS). The various structures can simultaneously guide photons and phonons in a suspended membrane. By utilizing a suspended membrane, a substrate pathway can be eliminated for loss of phonons that suppresses SBS in conventional silicon-on-insulator (SOI) waveguides. Consequently, forward-SBS nonlinear susceptibilities are achievable at about 3000 times greater than achievable with a conventional waveguide system. Owing to the strong phonon-photon coupling achievable with the various embodiments, potential application for the various embodiments presented herein cover a range of radiofrequency (RF) and photonic signal processing applications. Further, the various embodiments presented herein are applicable to applications operating over a wide bandwidth, e.g. 100 MHz to 50 GHz or more.


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