The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jul. 21, 2014
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Carol E. Anway, North Bend, WA (US);

Andrew M. Robb, Ravensdale, WA (US);

Jeong-Beom Ihn, Bellevue, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 3/00 (2006.01); G01N 27/02 (2006.01); B29C 65/48 (2006.01); B29C 65/50 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); G01N 27/20 (2006.01); B64C 3/20 (2006.01); B64D 45/00 (2006.01); G01M 5/00 (2006.01); B29L 31/30 (2006.01); B29K 105/20 (2006.01); F16B 11/00 (2006.01); B64C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/025 (2013.01); B29C 65/483 (2013.01); B29C 65/5021 (2013.01); B29C 65/5028 (2013.01); B29C 65/5057 (2013.01); B29C 65/8276 (2013.01); B29C 65/8284 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/721 (2013.01); B64C 3/20 (2013.01); B64D 45/00 (2013.01); G01M 5/0033 (2013.01); G01M 5/0083 (2013.01); G01M 5/0091 (2013.01); G01N 27/026 (2013.01); G01N 27/20 (2013.01); B29C 65/4835 (2013.01); B29C 65/8292 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/72143 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29K 2105/206 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/3079 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3085 (2013.01); B64C 2001/0072 (2013.01); B64D 2045/0085 (2013.01); F16B 11/006 (2013.01);
Abstract

A system for monitoring electrical current passing through a cured bondline may include a current sensor network embedded in an adhesive layer of the cured bondline. The current sensor network may include a plurality of inductive coils and a plurality of current sensor nodes electrically interconnecting the inductive coils to form a plurality of current sensor loops generating induced current in response to a magnetic field associated with an electrical current passing through the adhesive layer. The current sensor nodes may generate current signals representative of the induced current. The current sensor network may include a digital data communications network located external to the cured bondline and receiving the current signals from the current sensor nodes and detecting and monitoring electrical current passing through the cured bondline based on the current signals.


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