The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jan. 13, 2014
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventor:

Maria Celeste Rellamas Tria, Houston, TX (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); C23C 18/34 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/31 (2006.01); C23C 18/44 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01); C23C 18/30 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
C23C 18/34 (2013.01); C23C 18/161 (2013.01); C23C 18/1612 (2013.01); C23C 18/1646 (2013.01); C23C 18/1648 (2013.01); C23C 18/1667 (2013.01); C23C 18/18 (2013.01); C23C 18/1851 (2013.01); C23C 18/1879 (2013.01); C23C 18/31 (2013.01); C23C 18/44 (2013.01); H05K 3/182 (2013.01); H05K 3/187 (2013.01); H05K 3/389 (2013.01); C23C 18/30 (2013.01); C23C 18/405 (2013.01); H05K 2203/013 (2013.01); Y10T 428/24851 (2015.01); Y10T 428/24893 (2015.01);
Abstract

A conductive metal pattern can be formed using a titania sol-gel obtained from a titania precursor composition having (a) a titanium alkoxide or titanium aryloxide, (b) a R(O)COCHCO(O)R' compound wherein R and R′ are independently alkyl and m and n are independently 0 or 1, (c) water, (d) either an acid having a pKless than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, wherein the molar amounts of (a) through (d) are sufficient to form a pattern of a titania sol-gel upon drying on the substrate. This pattern is contacted with electroless seed metal ions to form a pattern of electroless seed metal ions deposited within the pattern of titania sol-gel on the substrate, which electroless seed metal ions are exposed to electromagnetic radiation to reduce the electroless seed metal. The article is then subjected to electroless metal plating.


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