The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Oct. 22, 2013
Applicant:

Taimide Technology Incorporation, Hsinchu County, TW;

Inventors:

Chung-Yi Chen, Hsinchu County, TW;

Chih-Wei Lin, Hsinchu County, TW;

Chi-Huan Lo, Hsinchu County, TW;

Shihan Tai, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); C09D 179/08 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); C08K 13/02 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); C08G 73/10 (2013.01); C08J 5/18 (2013.01); C08K 13/02 (2013.01); C08L 79/08 (2013.01); C08J 2379/08 (2013.01); C08J 2479/08 (2013.01); Y10T 428/31721 (2015.04);
Abstract

A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.


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